Title :
Influence of the Thermal Treatment During the Saw Damage Etching Process on the Mechanical Stability of Multicrystalline Silicon Wafers
Author :
Borchert, D. ; Riepe, S. ; Kubler, R. ; Beinert, J. ; Kraft, T. ; Kleer, G. ; Petri, S.
Author_Institution :
Fraunhofer-Inst. for Solar Energy Syst., Freiburg
Abstract :
The influence of the thermal treatment during the saw damage etching process on the mechanical stability of multicrystalline silicon wafers has been investigated for four different alkaline saw damage etching procedures. After the different etching procedures the mechanical stabilities of the multicrystalline wafers have been measured using the concentric ring test and the four-point-bending test. The experimental results are compared to those obtained by numerical simulations
Keywords :
elemental semiconductors; etching; heat treatment; mechanical stability; silicon; solar cells; Si; concentric ring test; four-point-bending test; mechanical stability; multicrystalline silicon wafers; numerical simulations; saw damage etching process; thermal treatment; Costs; Etching; Photovoltaic cells; Production; Silicon; Temperature; Testing; Thermal stability; Thermal stresses; Water heating;
Conference_Titel :
Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
Conference_Location :
Waikoloa, HI
Print_ISBN :
1-4244-0017-1
Electronic_ISBN :
1-4244-0017-1
DOI :
10.1109/WCPEC.2006.279330
