Title :
Electrical Analysis of Electronics Packaging
Author_Institution :
Department of Electrical and Computer Engineering, Rutgers University, NJ, USA
Abstract :
Summary form only for tutorial.
Keywords :
Crosstalk; Electronics packaging; Inductance; Integrated circuit manufacture; Integrated circuit modeling; Integrated circuit noise; Integrated circuit packaging; Parasitic capacitance; RLC circuits; Signal analysis;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
DOI :
10.1109/ESTC.2006.279962
