DocumentCode
460225
Title
FEM Support of Industrial Design for Manufacturing & Reliability in Electronics Packaging
Author
Rzepka, S. ; Dudek, R. ; Wiese, S.
Author_Institution
Qimonda, Dresden, Germany
Volume
1
fYear
2006
fDate
5-7 Sept. 2006
Abstract
Summary form only for tutorial.
Keywords
Deformable models; Electronics industry; Electronics packaging; Failure analysis; Inorganic materials; Integrated circuit packaging; Integrated circuit reliability; Manufacturing industries; Materials reliability; Power dissipation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Type
conf
DOI
10.1109/ESTC.2006.279965
Filename
4060689
Link To Document