DocumentCode :
460252
Title :
Novel Releasable Multi-Fiber Optical Connectivity Solution for Optical Communication using V-Grooves and Micro-Lens Arrays
Author :
Kunde, J. ; Pliska, A.C. ; Krasnopolski, K. ; Grossmann, S. ; Bosshard, Ch. ; Bauknecht, R. ; Soufiane, A. ; Krahenbiihl, R. ; Zaina, P. ; Ammer, T. ; Peterhans, A.
Author_Institution :
CSEM, Alpnach
Volume :
1
fYear :
2006
fDate :
5-7 Sept. 2006
Firstpage :
268
Lastpage :
273
Abstract :
We present a releasable multifiber connectivity solution for parallel optical links, which is realized by combining fiber arrays, microlens arrays, and V-grooves. Vision and active alignment are used to assemble the different parts. A low-cost adhesive bonding technology was developed for attaching the microlens arrays to the substrates. Optical coupling losses (per lens transition) of well below 1 dB for multi-mode fibers, and below 0.5 dB for single mode fibers over 12 channels for 850 nm, 1300 nm and 1550 nm wavelength were achieved. First reliability tests confirmed mechanically stable adhesive bonds under temperature cycling and damp-heat stress conditions, as well as optical loss variations below 0.2 dB for temperature cycling between -40degC and 50degC. In addition, a first realization of a releasable 90deg connection between fiber arrays based on V-groove alignment is presented
Keywords :
adhesive bonding; assembling; microlenses; optical arrays; optical fibre couplers; optical fibre fabrication; -40 to 50 C; 1300 nm; 1550 nm; 850 nm; V-groove alignment; adhesive bonding technology; assembling; damp-heat stress conditions; fiber arrays; microlens arrays; multifiber optical connectivity solution; multimode fibers; optical communication; optical coupling losses; optical links; optical loss; single mode fibers; substrates; temperature cycling; Assembly; Bonding; Joining processes; Lenses; Microoptics; Optical arrays; Optical coupling; Optical fiber communication; Optical fiber testing; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
Type :
conf
DOI :
10.1109/ESTC.2006.280009
Filename :
4060733
Link To Document :
بازگشت