• DocumentCode
    460264
  • Title

    Theory and Practical Experience of Micro-Alloyed SnCu0.7NiGe (SN100C)

  • Author

    Laentzsch, Michael

  • Author_Institution
    Balver Zinn Josef Jost GmbH & Co. KG, Balve
  • Volume
    1
  • fYear
    2006
  • fDate
    5-7 Sept. 2006
  • Firstpage
    383
  • Lastpage
    386
  • Abstract
    The remarkable properties of Ni-Ge micro-alloyed SnCu0.7 are described and the mode of functioning of grain fining with nickel and germanium is explained. In particular, action is turned to the risk of copper dissolution and stabilization of the intermetallic layers. The principle of metallurgy helps to understand the service performance of the micro-alloyed tin copper alloy SN100C in the field of electronics
  • Keywords
    alloying; copper alloys; germanium alloys; metallurgy; nickel alloys; tin alloys; SnCu-NiGe; copper dissolution; grain fining; intermetallic layer stabilization; metallurgy principle; micro-alloyed SN100C; Cooling; Copper alloys; Environmentally friendly manufacturing techniques; Germanium; Intermetallic; Lead; Nickel; Silver; Soldering; Tin alloys;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Systemintegration Technology Conference, 2006. 1st
  • Conference_Location
    Dresden
  • Print_ISBN
    1-4244-0552-1
  • Electronic_ISBN
    1-4244-0553-x
  • Type

    conf

  • DOI
    10.1109/ESTC.2006.280030
  • Filename
    4060754