DocumentCode
460272
Title
Reliability of High Temperature Lead-Free Solder Alternative
Author
McCluskey, F.P. ; Wang, Z. ; Dash, M. ; Huff, D.
Author_Institution
CALCE EPSC/Department of Mech. Eng., Maryland Univ., College Park, MD
Volume
1
fYear
2006
fDate
5-7 Sept. 2006
Firstpage
444
Lastpage
447
Abstract
European RoHS directives are driving the substitution of Pb-free solders for Pb-containing solders at the component to board level in order to reduce toxicity concerns. While European RoHS regulations currently exempt high Pb solders used for component and die attach in high temperature applications, there is a strong drive to find Pb-free alternatives for these high temperature electronic applications, as well. This paper presents constitutive and reliability information on one of the widely used high lead solder materials as a baseline, and discusses a potential alternative technology for high temperature solder that can be used at temperatures greater than 200degC
Keywords
RoHS compliance; microassembling; reliability; solders; European RoHS regulations; board level; die attach; high temperature solder alternative; lead-free solder alternative; reduce toxicity; reliability; Capacitive sensors; Copper; Environmentally friendly manufacturing techniques; Fatigue; Joining materials; Lead; Power system reliability; Soldering; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location
Dresden
Print_ISBN
1-4244-0552-1
Electronic_ISBN
1-4244-0553-x
Type
conf
DOI
10.1109/ESTC.2006.280040
Filename
4060764
Link To Document