• DocumentCode
    460272
  • Title

    Reliability of High Temperature Lead-Free Solder Alternative

  • Author

    McCluskey, F.P. ; Wang, Z. ; Dash, M. ; Huff, D.

  • Author_Institution
    CALCE EPSC/Department of Mech. Eng., Maryland Univ., College Park, MD
  • Volume
    1
  • fYear
    2006
  • fDate
    5-7 Sept. 2006
  • Firstpage
    444
  • Lastpage
    447
  • Abstract
    European RoHS directives are driving the substitution of Pb-free solders for Pb-containing solders at the component to board level in order to reduce toxicity concerns. While European RoHS regulations currently exempt high Pb solders used for component and die attach in high temperature applications, there is a strong drive to find Pb-free alternatives for these high temperature electronic applications, as well. This paper presents constitutive and reliability information on one of the widely used high lead solder materials as a baseline, and discusses a potential alternative technology for high temperature solder that can be used at temperatures greater than 200degC
  • Keywords
    RoHS compliance; microassembling; reliability; solders; European RoHS regulations; board level; die attach; high temperature solder alternative; lead-free solder alternative; reduce toxicity; reliability; Capacitive sensors; Copper; Environmentally friendly manufacturing techniques; Fatigue; Joining materials; Lead; Power system reliability; Soldering; Temperature; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Systemintegration Technology Conference, 2006. 1st
  • Conference_Location
    Dresden
  • Print_ISBN
    1-4244-0552-1
  • Electronic_ISBN
    1-4244-0553-x
  • Type

    conf

  • DOI
    10.1109/ESTC.2006.280040
  • Filename
    4060764