Title :
A New Method of Flip Chip Assembly Using a Light Silver Filled Glue
Author :
Feil, Michael ; Konig, Martin ; Bock, Karlheinz
Author_Institution :
Fraunhofer IZM, Munchen
Abstract :
Automated and cost-efficient manufacturing processes are of paramount importance for low-cost mass products. One for a bottle neck of the manufacturing transponder is the present chip assembly. ICs are assembled by flip chip adhesive technology using anisotropic or non-conductive adhesives. Simultaneous, both pressure and temperature are required, meaning a high process engineering complexity for mass products. An adhesive, lightly filled with Ag, is used in the proposed new development. Pressure is required but momentarily during placing the chip. For curing only temperature is used. Contact resistance in the range of mOhm and insulation resistance between neighboring bond pads of >20 MOhm were realised and proved by test chips
Keywords :
adhesives; assembling; contact resistance; curing; flip-chip devices; silver; Ag; anisotropic adhesives; contact resistance; flip chip adhesive technology; flip chip assembly; insulation resistance; light silver filled glue; nonconductive adhesives; Anisotropic magnetoresistance; Assembly; Contact resistance; Flip chip; Manufacturing processes; Neck; Nonconductive adhesives; Silver; Temperature; Transponders;
Conference_Titel :
Electronics Systemintegration Technology Conference, 2006. 1st
Conference_Location :
Dresden
Print_ISBN :
1-4244-0552-1
Electronic_ISBN :
1-4244-0553-x
DOI :
10.1109/ESTC.2006.280055
