DocumentCode :
461383
Title :
Experimental Study of Temperature Dependence of Program/Erase Endurance of Embedded Flash Memories with 2T-FNFN Device Architecture
Author :
Tao, Guoqiao ; Chauveau, Helene ; Nath, Som
Author_Institution :
NXP Semicond., Nijmegen
fYear :
2006
fDate :
Oct. 16 2006-Sept. 19 2006
Firstpage :
76
Lastpage :
79
Abstract :
Most of the flash endurance results reported so far are typically in a temperature range of -40degC to +85degC, while devices in automotive "under the hood" applications can experience up to 150degC. This paper reports the temperature dependence of FN/FN based flash memories. Experiments have been carried out on 2.7Mb test memory arrays with temperatures up to 150degC. An empirical model has been developed to describe the temperature dependent degradation of the Vt window. This model fits the experimental data over the whole temperature range, and the endurance performance with single shot P/E cycles exceeds 1 million cycles
Keywords :
embedded systems; flash memories; memory architecture; -40 to 85 C; 2.7 MByte; 2T-FNFN device architecture; FN/FN based flash memories; embedded flash memories; program/erase endurance; temperature dependence; Automotive engineering; Character generation; Degradation; Electrons; Flash memory; Interface states; Manufacturing; Temperature dependence; Temperature distribution; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 2006 IEEE International
Conference_Location :
South Lake Tahoe, CA
ISSN :
1930-8841
Print_ISBN :
1-4244-0296-4
Electronic_ISBN :
1930-8841
Type :
conf
DOI :
10.1109/IRWS.2006.305215
Filename :
4098692
Link To Document :
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