DocumentCode :
463623
Title :
Minimizing Global Interconnect in DSP Systems using Bypassing
Author :
Wong, Jennifer L. ; Megerian, Seapahn ; Potkonjak, Miodrag
Author_Institution :
Dept. of Comput. Sci., Stony Brook Univ., NY
Volume :
2
fYear :
2007
fDate :
15-20 April 2007
Abstract :
There is a wide consensus that performance and power consumption of IC designs in deep submicron technologies is mainly dictated by interconnect requirements. Our goal is demonstrate how compilation and architectural techniques can be used to minimize and balance interconnect requirements. Specifically, we target the use of bypass units to reduce routing congestion and eliminate long interconnections while essentially preserving or even improving the throughput requirements. We formulate the bypassing problem, establish its complexity and develop an efficient integer-linear programming (ILP) formulation. In addition to satisfying user specified interconnect requirements, we simultaneously optimize the number of operations and, therefore runtime of the targeted application. The approach is prototyped and evaluated using a platform consisting of the Trimaran architecture and compilation tools and the CPLEX ILP solver.
Keywords :
digital signal processing chips; integer programming; integrated circuit interconnections; linear programming; CPLEX ILP solver; DSP systems; IC designs; Trimaran architecture; bypassing; compilation tools; deep submicron technologies; global interconnect; integer-linear programming; long interconnections elimination; power consumption; routing congestion reduction; Clocks; Design optimization; Digital signal processing; Energy consumption; Integrated circuit interconnections; Minimization; Power system interconnection; Routing; Runtime; Throughput; Circuit optimization; Circuit synthesis; Digital Signal Processors; Multiprocessor interconnection;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Acoustics, Speech and Signal Processing, 2007. ICASSP 2007. IEEE International Conference on
Conference_Location :
Honolulu, HI
ISSN :
1520-6149
Print_ISBN :
1-4244-0727-3
Electronic_ISBN :
1520-6149
Type :
conf
DOI :
10.1109/ICASSP.2007.366176
Filename :
4217349
Link To Document :
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