• DocumentCode
    463623
  • Title

    Minimizing Global Interconnect in DSP Systems using Bypassing

  • Author

    Wong, Jennifer L. ; Megerian, Seapahn ; Potkonjak, Miodrag

  • Author_Institution
    Dept. of Comput. Sci., Stony Brook Univ., NY
  • Volume
    2
  • fYear
    2007
  • fDate
    15-20 April 2007
  • Abstract
    There is a wide consensus that performance and power consumption of IC designs in deep submicron technologies is mainly dictated by interconnect requirements. Our goal is demonstrate how compilation and architectural techniques can be used to minimize and balance interconnect requirements. Specifically, we target the use of bypass units to reduce routing congestion and eliminate long interconnections while essentially preserving or even improving the throughput requirements. We formulate the bypassing problem, establish its complexity and develop an efficient integer-linear programming (ILP) formulation. In addition to satisfying user specified interconnect requirements, we simultaneously optimize the number of operations and, therefore runtime of the targeted application. The approach is prototyped and evaluated using a platform consisting of the Trimaran architecture and compilation tools and the CPLEX ILP solver.
  • Keywords
    digital signal processing chips; integer programming; integrated circuit interconnections; linear programming; CPLEX ILP solver; DSP systems; IC designs; Trimaran architecture; bypassing; compilation tools; deep submicron technologies; global interconnect; integer-linear programming; long interconnections elimination; power consumption; routing congestion reduction; Clocks; Design optimization; Digital signal processing; Energy consumption; Integrated circuit interconnections; Minimization; Power system interconnection; Routing; Runtime; Throughput; Circuit optimization; Circuit synthesis; Digital Signal Processors; Multiprocessor interconnection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Acoustics, Speech and Signal Processing, 2007. ICASSP 2007. IEEE International Conference on
  • Conference_Location
    Honolulu, HI
  • ISSN
    1520-6149
  • Print_ISBN
    1-4244-0727-3
  • Electronic_ISBN
    1520-6149
  • Type

    conf

  • DOI
    10.1109/ICASSP.2007.366176
  • Filename
    4217349