Title :
Low Temperature Carbon Nanotube Film Transfer via Conductive Adhesives
Author :
Jiang, Hongjin ; Zhu, Lingbo ; Moon, Kyoung-Sik ; Li, Yi ; Wong, C.P.
Author_Institution :
Georgia Inst. of Technol., Atlanta
fDate :
May 29 2007-June 1 2007
Abstract :
A low temperature process for transferring carbon nanotube (CNT) film from a silicon wafer to a copper surface via conductive adhesives is proposed. Both the close-and open-ended CNT films were successfully transferred to a desirable substrate. The morphologies and electrical properties of the transferred CNT films were studied. An ohmic contact was formed between a CNT film and a highly conductive adhesive, while a semiconductor joint was formed between a CNT film and a high resistivity adhesive.
Keywords :
carbon nanotubes; conductive adhesives; copper; ohmic contacts; silicon; CNT; carbon nanotube film transfer; conductive adhesives; copper surface; low temperature process; ohmic contact; semiconductor joint; silicon wafer; Carbon nanotubes; Conductive adhesives; Conductive films; Copper; Ohmic contacts; Semiconductor films; Silicon; Substrates; Surface morphology; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.373838
