Title :
Moisture Ingression Effect on Stress Distributions in NCF-Bonded COG Packages
Author :
Tsai, M.Y. ; Wu, C.Y. ; Huang, C.Y. ; Yang, S.S.
Author_Institution :
Chang Gung Univ., Tao-Yuan
fDate :
May 29 2007-June 1 2007
Abstract :
The objective of this paper is to investigate the effect of moisture ingression on stress field of the COG packages with NCF bonding. The coefficients of moisture diffusion and the hygro-strains of the NCF adhesive have been determined by an innovative approach of measuring the out-of-plane deformation of the bi-material specimens during moisture absorption at the condition of 30degC /85%RH using Twyman-Green interferometry, associated with a finite element analysis and bi-material theory. It can be concluded that the stress states of the NCF-bonded COG packages induced by transient moisture ingression have been fully addressed through experimental, theoretical and numerical approaches in this study.
Keywords :
adhesive bonding; adhesives; chip scale packaging; diffusion; electronics packaging; finite element analysis; integrated circuit reliability; light interferometry; liquid crystal displays; moisture; stress analysis; NCF-bonded COG packages; Twyman-Green interferometry; anisotropic conductive film adhesives; bi-material plate; bi-material theory; chip-on-glass packages; finer bump pitch feature; finite element analysis; liquid crystal displays; moisture absorption; moisture diffusion coefficients; nonconductive film adhesives; out-of-plane deformation; stress distributions; transient moisture ingression effect; Absorption; Anisotropic conductive films; Bonding; Costs; Finite element methods; Liquid crystal displays; Moisture; Packaging; Polyimides; Tensile stress;
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2007.373839
