Moisture Ingression Effect on Stress Distributions in NCF-Bonded COG Packages

Author

Tsai, M.Y. ; Wu, C.Y. ; Huang, C.Y. ; Yang, S.S.

Author_Institution

Chang Gung Univ., Tao-Yuan

fYear

2007

fDate

May 29 2007-June 1 2007

Firstpage

467

Lastpage

474

Abstract

The objective of this paper is to investigate the effect of moisture ingression on stress field of the COG packages with NCF bonding. The coefficients of moisture diffusion and the hygro-strains of the NCF adhesive have been determined by an innovative approach of measuring the out-of-plane deformation of the bi-material specimens during moisture absorption at the condition of 30degC /85%RH using Twyman-Green interferometry, associated with a finite element analysis and bi-material theory. It can be concluded that the stress states of the NCF-bonded COG packages induced by transient moisture ingression have been fully addressed through experimental, theoretical and numerical approaches in this study.

Keywords

adhesive bonding; adhesives; chip scale packaging; diffusion; electronics packaging; finite element analysis; integrated circuit reliability; light interferometry; liquid crystal displays; moisture; stress analysis; NCF-bonded COG packages; Twyman-Green interferometry; anisotropic conductive film adhesives; bi-material plate; bi-material theory; chip-on-glass packages; finer bump pitch feature; finite element analysis; liquid crystal displays; moisture absorption; moisture diffusion coefficients; nonconductive film adhesives; out-of-plane deformation; stress distributions; transient moisture ingression effect; Absorption; Anisotropic conductive films; Bonding; Costs; Finite element methods; Liquid crystal displays; Moisture; Packaging; Polyimides; Tensile stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th

Conference_Location

Reno, NV

ISSN

0569-5503

Print_ISBN

1-4244-0985-3

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2007.373839

Filename

4249925