• DocumentCode
    465185
  • Title

    A New Approach for Design and Verification of Transaction Level Models

  • Author

    Kakoee, Mohammad Reza ; Shojaei, Hamid ; Ghasemzadeh, Hassan ; Sirjani, Marjan ; Navabi, Zainalabedin

  • Author_Institution
    Electr. & Comput. Eng., Tehran Univ.
  • fYear
    2007
  • fDate
    27-30 May 2007
  • Firstpage
    3760
  • Lastpage
    3763
  • Abstract
    Transaction level modeling allows exploring several SoC design architectures leading to better performance and easier verification of the final product. In this paper, we present an approach for design and verification of transaction level models. Verification is integrated as part of the design-flow. In the proposed method, we first model the design in UML. Then, we translate it into the reactive objects language, Rebeca (Marjan Sirjani et al., 2004), which is an actor-based language with formal foundation. A model in Rebeca is a set of concurrently executed reactive objects (called rebecs) interacted by asynchronous message passing. After mapping UML to Rebeca, Rebeca code will be translated into Promela which is a language for formal verification. Checking the correctness of the design is performed on-the-fly with the LTL properties using the SPIN model checker. Finally, we translate the verified design to SystemC and map the properties to a set of assertions that can be re-used to validate the design at lower levels through simulation.
  • Keywords
    integrated circuit design; integrated circuit modelling; system-on-chip; Promela; Rebeca code; SPIN model checker; SoC design architectures; SystemC; UML; actor-based language; asynchronous message passing; concurrently executed reactive objects; formal foundation; formal verification; reactive objects language; rebecs; transaction level modeling; Computer architecture; Design methodology; Formal verification; Hardware; Message passing; Object oriented modeling; Productivity; Software engineering; Specification languages; Unified modeling language;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2007. ISCAS 2007. IEEE International Symposium on
  • Conference_Location
    New Orleans, LA
  • Print_ISBN
    1-4244-0920-9
  • Electronic_ISBN
    1-4244-0921-7
  • Type

    conf

  • DOI
    10.1109/ISCAS.2007.378779
  • Filename
    4253499