DocumentCode
465348
Title
CAD Implications of New Interconnect Technologies
Author
Scheffer, Louis K.
Author_Institution
Cadence, San Jose
fYear
2007
fDate
4-8 June 2007
Firstpage
576
Lastpage
581
Abstract
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a replacement for metal interconnects, and optical interconnections for longer range on-chip communication. Each of these requires new CAD support to be used effectively.
Keywords
carbon nanotubes; circuit CAD; integrated circuit design; integrated circuit interconnections; CAD support; carbon nanotube; interconnect technology; metal interconnect; on-chip communication; optical interconnection; three dimensional IC; Algorithm design and analysis; Carbon nanotubes; Integrated circuit interconnections; Integrated circuit technology; Optical design; Optical interconnections; Permission; Photonic integrated circuits; Proposals; Routing; 3D interconnect; Algorithms; Design; Nanotubes; On-chip optical; Performance;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2007. DAC '07. 44th ACM/IEEE
Conference_Location
San Diego, CA
ISSN
0738-100X
Print_ISBN
978-1-59593-627-1
Type
conf
Filename
4261249
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