DocumentCode :
46707
Title :
The GaN-Based Light Emitting Diode Grown on Nanopattern Sapphire Substrate Prepared by Inductively Coupled Plasma Etching
Author :
Jyun-Hao Lin ; Shyh-Jer Huang ; Yan-Kuin Su ; Kai-Wen Huang
Author_Institution :
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Volume :
42
Issue :
12
fYear :
2014
fDate :
Dec. 2014
Firstpage :
3792
Lastpage :
3796
Abstract :
We applied nanoimprint lithography to fabricate nanopattern sapphire substrate. Because the imprint resin cannot endure the inductively coupled plasma bombardment, we use Ni metal to replace the resin as our etching mask. And then, we tuned the parameters to achieve a depth-enough nanopattern sapphire substrate (200-500-nm thick). Then, light emitting diode (LED) structures were grown and the quality was characterized by X-ray diffraction and photoluminescence. The LED tester and integrating sphere were used to analyze the device property. The results could demonstrate that the film quality was improved with increasing etching depth. And, the compressive strain was also released with increasing etching depth. In addition, increasing etching depth could not only improve internal quantum efficiency, but also improve light extraction efficiency. Thus, the external quantum efficiency was enhanced. These evidences demonstrated that nanopatterned sapphire with deeper depth certainly enhanced performance of LEDs.
Keywords :
III-V semiconductors; X-ray diffraction; compressive strength; gallium compounds; light emitting diodes; nanofabrication; nanolithography; nanopatterning; photoluminescence; semiconductor growth; sputter etching; wide band gap semiconductors; Al2O3; GaN; GaN-based light emitting diode; X-ray diffraction; compressive strain; depth-enough nanopattern sapphire substrate; inductively coupled plasma bombardment; inductively coupled plasma etching; internal quantum efficiency; nanoimprint lithography; nanopattern sapphire substrate; photoluminescence; size 200 nm to 500 nm; Etching; Gallium nitride; Iterative closest point algorithm; Light emitting diodes; Nickel; Resins; Substrates; Etching rate; GaN; inductively coupled plasma (ICP); selectivity;
fLanguage :
English
Journal_Title :
Plasma Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0093-3813
Type :
jour
DOI :
10.1109/TPS.2014.2346245
Filename :
6883225
Link To Document :
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