Title :
Review: Fine Embossing of Novel Glasses for Photonic Integrated Circuits
Author :
Seddon, A.B. ; Furniss, D. ; Pan, W.J. ; Sewell, P. ; Loni, A. ; Zhang, Y. ; Benson, T.M.
Author_Institution :
Univ. of Nottingham, Nottingham
Abstract :
Hot embossing of novel inorganic-compound glasses is a new fabrication technology for guided wave devices and circuitry. A patterned mould is pressed into the glass above its glass transition temperature (Tg) and replicated; cooling below Tg freezes-in the required pattern. The state-of-the-art is reviewed. Better than 0.1 mum-scale replication is shown for chalcogenide glasses and fabrication of a hot embossed monomode waveguide demonstrated.
Keywords :
embossing; inorganic compounds; integrated optics; moulding; optical fabrication; optical glass; optical waveguides; inorganic-compound glasses; mould; photonic integrated circuits; state-of-the-art; Embossing; Fiber nonlinear optics; Glass; Nonlinear optics; Optical refraction; Optical sensors; Optical variables control; Optical waveguides; Photonic integrated circuits; Silicon compounds;
Conference_Titel :
Transparent Optical Networks, 2007. ICTON '07. 9th International Conference on
Conference_Location :
Rome
Print_ISBN :
1-4244-1249-8
Electronic_ISBN :
1-4244-1249-8
DOI :
10.1109/ICTON.2007.4296204
