• DocumentCode
    467754
  • Title

    The Testing and Analysis Technology for Temperature Field of Low-Voltage Circuit Breaker

  • Author

    Chen, Gang ; Liu, Jiao-min ; Wei, Xue-jie ; Liu, Jin-mei

  • Author_Institution
    Hebei Univ. of Technol., Tianjin
  • Volume
    3
  • fYear
    2007
  • fDate
    19-22 Aug. 2007
  • Firstpage
    1459
  • Lastpage
    1463
  • Abstract
    This paper introduces the principle of the fiber bragg gratings (FBG) sensor and basis of temperature analysis. According to the key technology for the fiber grating sensor which is used to detect the temperature to low-voltage circuit breaker, the technical architecture of an on-line temperature monitoring system in intelligence electric apparatus is put forward. And then, using the finite element analysis software Ansoft Maxwell, a model for the arc-extinguishing chamber of low-voltage circuit breaker was established. The temperature field was analyzed and the figures of temperature field distribution in the arc-extinguishing chamber were obtained.
  • Keywords
    Bragg gratings; circuit breakers; computerised monitoring; fibre optic sensors; finite element analysis; low-power electronics; mathematics computing; power engineering computing; switchgear testing; temperature distribution; temperature sensors; arc-extinguishing chamber model; fiber bragg gratings sensor; fiber bragg gratings sensor principle; finite element analysis software Ansoft Maxwell; intelligence electric apparatus; low-voltage circuit breaker; online temperature monitoring system; temperature field distribution; Bragg gratings; Circuit breakers; Circuit testing; Fiber gratings; Intelligent sensors; Optical fiber sensors; Optical fiber testing; Sensor systems; Temperature distribution; Temperature sensors; Arc-extinguishing chamber; Fiber bragg gratings; Low-voltage; System architecture; Temperature field analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Machine Learning and Cybernetics, 2007 International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-0973-0
  • Electronic_ISBN
    978-1-4244-0973-0
  • Type

    conf

  • DOI
    10.1109/ICMLC.2007.4370375
  • Filename
    4370375