Title :
Development of an Electrostatic Discharge Protection Solution in GaN Technology
Author :
Zhixin Wang ; Liou, Juin J. ; Kuan-Liang Cho ; Hsien-Chin Chiu
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL, USA
Abstract :
In this letter, a robust and effective gallium nitride (GaN)-pHEMT-based electrostatic discharge (ESD) protection structure is developed for the first time. The structure consists of a depletion-mode GaN pHEMT, a trigger diode chain, a pinchoff diode chain, and a current limiter. Results pertinent to critical ESD parameters, such as the trigger voltage, leakage current, on-state resistance, and robustness, are measured using the transmission line pulsing (TLP) tester. It is demonstrated that such an ESD clamp can sustain a TLP stress of up to 3 A. The two diode chains are found to play critical roles in determining the trigger voltage and leakage current. Increasing the trigger diode number increases the trigger voltage. On the other hand, adding more pinchoff diodes also increases the trigger voltage and simultaneously reduces the leakage current. The design tradeoffs for the proposed ESD clamp are also discussed.
Keywords :
III-V semiconductors; electrostatic discharge; gallium compounds; high electron mobility transistors; wide band gap semiconductors; ESD clamp; GaN; TLP stress; TLP tester; critical ESD parameters; current limiter; diode chain; electrostatic discharge protection solution; gallium nitride pHEMT-based ESD protection structure; gallium nitride technology; leakage current; leakage current reduction; on-state resistance; pinchoff diode chain; pinchoff diodes; transmission line pulsing tester; trigger diode chain; trigger diode number; trigger voltage; Clamps; Electrostatic discharges; Gallium nitride; Leakage currents; PHEMTs; Robustness; Schottky diodes; Electrostatic discharge (ESD); gallium nitride (GaN) technology; pHEMT;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2013.2283865