Title :
Prediction of Laser Cutting Qualities for BGA Strip by Artificial Neural Networks
Author :
Li, Chen-Hao ; Tsai, Ming-Jong ; Chen, Cheng-Che ; Li, Chun-Hao
Author_Institution :
Nat. Taiwan Univ. of Sci. & Technol., Taipei
Abstract :
This paper reports a new laser cutting technology for cut ting a BGA (ball grid array) strip. Due to the cutting path including two different materials, i.e. epoxy and copper substrate, so we adopt two cutting processes for epoxy and copper substrate, respectively. Then we utilize artificial neural networks (ANN) to build two predictive models including epoxy and substrate for laser cutting qualities of a strip BGA. Two ANN models use the back-propagation (BP) with Levenberg-Marquardt (LM) algorithm. From the experimental results, the average predicted errors of epoxy for training and testing processes are 0.496% and 1.786%, respectively, and the errors for substrate are 0.797% and 1.532%, respectively. The results show that two ANN models have the predictive ability to estimate three laser cutting qualities for BGA strip accurately. The ANN applied to this paper is very successfully and may give guides in the predictions of cutting BGA strip and is expected to be useful for laser applications in other industry fields.
Keywords :
backpropagation; ball grid arrays; copper; laser beam cutting; neural nets; production engineering computing; strips; substrates; Cu; Levenberg-Marquardt algorithm; artificial neural network; backpropagation; ball grid array strip; epoxy; heat affected zone; laser cutting; substrate; Artificial neural networks; Copper; Electronics packaging; Laser applications; Laser beam cutting; Laser modes; Optical materials; Predictive models; Strips; Testing; Artificial Neural network (ANN); Ball Grid Array (BGA) strip; Heat Affected Zone(HAZ); Levenberg-Marquardt (LM); back-propagation (BP);
Conference_Titel :
Machine Learning and Cybernetics, 2007 International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-0973-0
Electronic_ISBN :
978-1-4244-0973-0
DOI :
10.1109/ICMLC.2007.4370439