• DocumentCode
    469359
  • Title

    Computational Fluid Dynamics Simulation for On-chip Cooling with Carbon Nanotube Micro-fin Architectures

  • Author

    Zhong, Xiaolong ; Wang, Teng ; Liu, Johan ; Zhang, Yan ; Cheng, Zhaonian

  • Author_Institution
    Shanghai Univ., Shanghai
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The 2D CFD simulations have been carried out for a series of CNT micro-fin cooling architectures in this paper. The influence of micro-fin structures, fluid speeds and heating powers on cooling effects have been obtained in the case studies, and the numerical results have been compared with our experiment data. The CFD simulations indicate that the fluid speed is the key factor of heat transfer, and the heat generated on chip is removed by liquid mass flowing in the channels of micro-fin architectures. The pressure drop between inlet and outlet of the cooling device is an important cause limiting the fluid speed, and the excessive pressure drop will destroy the carbon nanotube fin arrays. The harmfulness condition of nanotube array is an unavoidable limitation for cooling capability of carbon nanotube micro-fin structures, and consequently it is necessary to study the harmful situations of carbon nanotube. The simulation results in present work also indicate that the cooling capability of 2D carbon nanotube fin array is more efficient than that of 1D carbon nanotube fin array.
  • Keywords
    carbon nanotubes; computational fluid dynamics; cooling; integrated circuit packaging; microchannel flow; thermal management (packaging); carbon nanotube microfin architectures; computational fluid dynamics simulation; cooling effects; heat transfer; liquid mass; microchannel heat sink; microelectronics packaging; on-chip cooling; Carbon nanotubes; Computational fluid dynamics; Computational modeling; Computer architecture; Cooling; Electronic packaging thermal management; Heat sinks; Heat transfer; Microchannel; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430587
  • Filename
    4430587