Reliability Analysis of a Package-on-Package Structure using the Novel WLCSP Technology with Fan-Out Capability

Author

Wei, Hsiu-Ping ; Yew, Ming-Chih ; Yang, Wen-Kung ; Chiang, Kuo-Ning

Author_Institution

Nat. Tsing Hua Univ., Hsinchu

fYear

2006

fDate

11-14 Dec. 2006

Firstpage

1

Lastpage

7

Abstract

In this study, a chip-on-metal wafer level package (CoM-WLCSP) with stacking and fan-out capabilities, and a package-on-package (PoP) structure using this CoM-WLCSP are proposed. Moreover, the concept of the CoM-WLCSP and the process of fabricating this novel WLCSP are described. The parametric analysis of the CoM-WLCSP in board level is also studied by using the three-dimensional finite element model to determine a reliable stacking unit. Afterwards, a preliminary study of the PoP structure by finite element analysis is conducted.

Keywords

chip scale packaging; finite element analysis; integrated circuit reliability; wafer level packaging; chip-on-metal wafer level package; fan-out capability; package-on-package structure; parametric analysis; stacking capability; three-dimensional finite element model; Chip scale packaging; Electronic packaging thermal management; Electronics packaging; Finite element methods; Integrated circuit packaging; Polymers; Soldering; Stacking; Stress; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on

Conference_Location

Kowloon

Print_ISBN

978-1-4244-0834-4

Electronic_ISBN

978-1-4244-0834-4

Type

conf

DOI

10.1109/EMAP.2006.4430594

Filename

4430594