Title :
The Evolution of CPU Packaging Technology and Future Challenges
Author :
Oh, Boon Howe ; Lee, Eng Kwong ; Loo, Howe Yin ; Oh, Poh Tat
Author_Institution :
Intel Microelectron. Sdn Bhd, Penang
Abstract :
The demand for high performance and robustness drive CPU to evolve from MHz to GHz and from single core to multi-core packages. This paper describes the changes in CPU packaging technology and its evolution in the past three decades.
Keywords :
electronics packaging; microprocessor chips; CPU packaging technology; microprocessor technology; multicore packages; Ceramics; Electronics industry; Electronics packaging; Microelectronics; Microprocessors; Pins; Protection; Robustness; Semiconductor device packaging; Thermal management;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430605
