Title :
Photosensitive polyimide for coverlay of flexible printed circuit
Author :
Jeng, Jhy-Long ; Tsai, Jeng-Yu ; Lu, Charng-Shing ; King, Jinn-Shing
Author_Institution :
Ind. Technol. Res. Inst., Hsinchu
Abstract :
The photosensitive polyimide coverlay film can simplify operate by photolithography process. After exposure and development, the resolution can reach about 50mum and the thickness is 12-20mum. In addition, the formed polyimide coverlay cured at 200degC can attain complete imidization. The result showed that the produced photosensitive polyimide coverlay film meets the specification requirements for the protective layer on high-level flexible circuit board.
Keywords :
flexible electronics; photolithography; polymer films; printed circuits; flexible circuit board; flexible printed circuit; imidization; photolithography process; photosensitive polyimide coverlay film; protective layer; size 12 mum to 20 mum; temperature 200 C; Assembly; Bonding; Costs; Flexible electronics; Flexible printed circuits; Integrated circuit packaging; Polyimides; Production; Resistance heating; Temperature;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007. International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-1637-0
Electronic_ISBN :
978-1-4244-1637-0
DOI :
10.1109/IMPACT.2007.4433638
