• DocumentCode
    471605
  • Title

    Biomechanical Modeling of Semicircular Canals for Fabricating a Biomimetic Vestibular System

  • Author

    Ciaravella, G. ; Laschi, C. ; Dario, P.

  • Author_Institution
    Sch. in Biorobotics Sci. & Eng., IMT Inst. of Adv. Studies, Lucca
  • fYear
    2006
  • fDate
    Aug. 30 2006-Sept. 3 2006
  • Firstpage
    1758
  • Lastpage
    1761
  • Abstract
    This paper presents a biomechanical model of the semicircular canals of the human vestibular system and the design of a 3D biomimetic structure that mimics the biological system. Starting from anatomical and physiological data, mechanical and structural parameters have been identified and a mathematical model has been formulated, by considering the semicircular organ as a canal filled by a liquid. The mathematical and mechanical models were used to simulate the behavior of the semicircular canals under known conditions of angular velocity and acceleration along three axes. Furthermore, the membrane inside the semicircular canals was simulated to understand what the mechanical properties of the membrane are and if polymeric materials can reproduce the mechanical characteristics of the biological organ. The results obtained from the model allow to design a biomimetic organ, as a part of a biomimetic vestibular system, by following this biomechatronic approach
  • Keywords
    biological organs; biomechanics; biomembranes; biomimetics; mechanoception; polymers; acceleration; angular velocity; biological organ; biomechanical modeling; biomechatronics; biomimetic vestibular system fabrication; mathematical model; mechanical characteristics; membrane; polymeric material; semicircular canal; Acceleration; Angular velocity; Biological system modeling; Biological systems; Biomembranes; Biomimetics; Humans; Irrigation; Mathematical model; Structural engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1557-170X
  • Print_ISBN
    1-4244-0032-5
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2006.260248
  • Filename
    4462114