• DocumentCode
    471705
  • Title

    Hybrid Silicon/Silicone (polydimethylsiloxane) Microsystem for Cell Culture

  • Author

    Christen, Jennifer Blain ; Andreou, Andreas G.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD
  • fYear
    2006
  • fDate
    Aug. 30 2006-Sept. 3 2006
  • Firstpage
    2490
  • Lastpage
    2493
  • Abstract
    We discuss the design, fabrication and testing of a hybrid microsystem for stand-alone cell culture and incubation. The micro-incubator is engineered through the integration of a silicon CMOS die for the heater and temperature sensor, with multilayer silicone PDMS (polydimethylsiloxane) structures namely, fluidic channels and a 4 mm diameter, 30muL, culture well. A 25 micron thick PDMS membrane covers the top of the culture well, acting as barrier to contaminants while allowing the cells to exchange gases with the ambient environment. The packaging for the microsystem includes a flexible polyimide electronic ribbon cable and four fluidic ports that provide external interfaces to electrical energy, closed loop sensing and electronic control as well as solid and liquid supplies. The complete structure has a size of (2.5times2.5times0.6 cm3). We have employed the device to successfully culture BHK-21 cells autonomously over a sixty hour period in ambient environment
  • Keywords
    cellular biophysics; dyes; polymers; silicon; tissue engineering; 25 micron; 4 mm; BHK-21 cells; cell culture; closed loop sensing; electronic control; flexible polyimide electronic ribbon cable; fluidic channel; heater; hybrid silicon-silicone microsystem; microincubator; multilayer silicone PDMS; polydimethylsiloxane; silicon CMOS die; temperature sensor; Biomembranes; Electronics packaging; Fabrication; Gases; Heat engines; Nonhomogeneous media; Polyimides; Silicon; Temperature sensors; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1557-170X
  • Print_ISBN
    1-4244-0032-5
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2006.260375
  • Filename
    4462300