• DocumentCode
    471798
  • Title

    Stochastic modeling of tumor induced angiogenesis in a heterogeneous medium, the extracellular matrix

  • Author

    Amyot, Franck ; Small, Alex ; Gandjbakhche, Amir H.

  • Author_Institution
    Lab. of Integrative & Med. Biophys., Nat. Inst. of Health, Bethesda, MD
  • fYear
    2006
  • fDate
    Aug. 30 2006-Sept. 3 2006
  • Firstpage
    3146
  • Lastpage
    3149
  • Abstract
    Angiogenesis, the formation of blood vessels, is a process whereby capillary sprout are formed in response to external stimuli. We model the tumor induced angiogenesis on keys events such of migratory response of endothelial cells to tumor angiogenic factors and the local cell interaction with the extracellular matrix (ECM). We consider the ECM medium as a statistically inhomogeneous two-phase random medium. Numerical simulations of the model are presented. Using this model, we will compare the influence of ECM distribution on vascular network formation. By developing mathematical models of angiogenesis, we hope to provide a deeper insight into the mechanisms underlying angiogenesis
  • Keywords
    blood vessels; cancer; cell motility; numerical analysis; random media; statistical analysis; stochastic processes; tumours; apoptosis; blood vessel formation; capillary sprout; cell migration; endothelial cells; external stimuli response; extracellular matrix distribution; local cell interaction; migratory response; numerical simulation; percolation; statistically inhomogeneous two-phase random medium; stochastic modeling; tumor angiogenic factors; tumor induced angiogenesis; vascular network formation; Blood vessels; Cities and towns; Electrochemical machining; Extracellular; Geometry; Mathematical model; Neoplasms; Proteins; Stochastic processes; USA Councils; angiogenesis; apoptosis; cell migration; percolation; vascular network;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1557-170X
  • Print_ISBN
    1-4244-0032-5
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2006.260358
  • Filename
    4462464