Title :
Fabrication Techniques for Improving the Performance of PVDF-on-Silicon Ultrasonic Transducer Arrays
Author :
Kim, Hyun-Joong ; Ziaie, Babak
Author_Institution :
Birck Nanotechnol. Center, Purdue Univ., West Lafayette, IN
fDate :
Aug. 30 2006-Sept. 3 2006
Abstract :
A PVDF-on-silicon 8-element ultrasound transducer array (1 mmtimes1 mm and element spacing of 1 mm) is fabricated and characterized. To improve the performance of the transducer, new CMOS-compatible fabrication technologies are introduced. These include: 1) micro-contact printing on non-radiating areas, and 2) glass microspheres (7-20 mum in diameter) embedded low melting temperature alloy (LMA) material for backside electrical connection. The first improvement removes the impedance mismatching of adhesive layer (e.g., lower sensitivity) between the PVDF and backside contact while the second one improves the pulse-echo signal quality by eliminating reflections at the backing/water interface. The fabricated array elements are tested in a water tank and their pulse-echo response are recorded. The central frequency of each element is 25 MHz with a 100% measured 6-dB bandwidth (60% 3-dB bandwidth)
Keywords :
adhesives; biomedical ultrasonics; impedance matching; micromachining; polymers; silicon; soft lithography; ultrasonic transducer arrays; 1 mm; 25 MHz; 7 to 20 micron; CMOS-compatible fabrication technology; PVDF-on-silicon ultrasonic transducer arrays; adhesive layer; array element testing; electrical connection; glass microspheres; impedance mismatching; low melting temperature alloy material; microcontact printing; nonradiating areas; pulse-echo response; pulse-echo signal quality; Bandwidth; CMOS technology; Fabrication; Glass; Impedance; Printing; Temperature sensors; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers;
Conference_Titel :
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location :
New York, NY
Print_ISBN :
1-4244-0032-5
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2006.259404