Title :
Design and Construction of Resonant Cavity Applicator for Brain Tumor Hyperthermia Treatment without Contact
Author :
Takahashi, Y. ; Kato, K. ; Tsuchiya, K. ; Yabuhara, T. ; Uzuka, T. ; Takahashi, H.
Author_Institution :
Dept. of Mech. Eng. Informatics, Meiji Univ., Kawasaki
fDate :
Aug. 30 2006-Sept. 3 2006
Abstract :
A re-entrant type resonant cavity applicator for brain tumor hyperthermia treatment is presented. In this method, a human brain is placed between the gap of the inner re-entrant cylinders without contact. This cavity has a window for insertion of the human head. Here, first, to design and construct a resonant cavity applicator, the results of the temperature distribution inside an agar phantom and electromagnetic field leaked from the attached window to the environment by the computer simulation were presented. Second, The developed resonant cavity and inner electrode, which were made of an aluminum alloy, were presented. Third, the experimental heating result of the agar phantom was presented. In the experiment, the center region of the agar phantom is heated to 42degC. The leaked electric field strength at the position of 10 cm away from the center of the window was less than that of 10% of the center of the agar phantom. It was found that the developed resonant cavity applicator was applicable to both deep and regional brain hyperthermia treatment
Keywords :
aluminium alloys; bioelectric phenomena; biomedical electrodes; brain; cancer; cavity resonators; hyperthermia; phantoms; temperature distribution; tumours; 10 cm; 42 C; agar phantom; aluminum alloy; brain tumor hyperthermia treatment; computer simulation; electric field strength; electromagnetic field leakage; human brain; inner electrode; re-entrant cylinders; resonant cavity applicator design; temperature distribution; Applicators; Computer simulation; Electrodes; Electromagnetic fields; Humans; Hyperthermia; Imaging phantoms; Neoplasms; Resonance; Temperature distribution;
Conference_Titel :
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location :
New York, NY
Print_ISBN :
1-4244-0032-5
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2006.260763