Title :
Biocompatible MEMS Electrode Array for Determination of Three-Dimensional Strain
Author :
Evans, Boyd M. ; Mahfouz, Mohamed R. ; Pritchard, Emily R.
Author_Institution :
Dept. of Mech., Aerosp. & Biomed. Eng., Tennessee Univ., Knoxville, TN
fDate :
Aug. 30 2006-Sept. 3 2006
Abstract :
Sensor arrays for the measurement of the load condition of polyethylene spacers in the total knee arthroplasty (TKA) prosthesis have been developed. Arrays of capacitive sensors are used to determine the three-dimensional strain within the polyethylene prosthesis component. Data from these sensors can be used to give researchers better understanding of component motion, loading, and wear phenomena for a large range of activities. These sensors implemented on a large scale will give clinicians feedback for individual patient biomechanics without the requirement for patient exposure to X-ray radiation. Patients will benefit from smart prosthetic components which allow clinicians monitor biomechanics and loading by applying noninvasive remedies such as orthotics or physical therapy for patients exhibiting poor biomechanics before wear or component failure become issues. In this paper, we present research regarding the design of a biocompatible strain sensor and the fabrication of microelectrode arrays on biocompatible polymer materials
Keywords :
bioMEMS; biomechanics; biomedical electrodes; biomedical materials; capacitive sensors; microelectrodes; microsensors; orthopaedics; polymers; prosthetics; sensor arrays; strain sensors; wear; biocompatible MEMS electrode array; capacitive sensor arrays; microelectrode array fabrication; noninvasive remedies; patient biomechanics; polyethylene spacers; polymer materials; smart prosthetic components; strain sensor; three-dimensional strain determination; total knee arthroplasty prosthesis; wear phenomena; Biomechanics; Biosensors; Capacitive sensors; Electrodes; Intelligent sensors; Micromechanical devices; Polyethylene; Prosthetics; Sensor arrays; Sensor phenomena and characterization;
Conference_Titel :
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location :
New York, NY
Print_ISBN :
1-4244-0032-5
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2006.259258