DocumentCode
471943
Title
Construction and Characterization of Soft-Supported Lipid Bilayer Membranes for Biosensors Application
Author
Jimenez, Jeffy ; Heim, August J., II ; Matthews, W. Garrett ; Alcantar, Norma
Author_Institution
Dept. of Chem. Eng., Univ. of South Florida, Tampa, FL
fYear
2006
fDate
Aug. 30 2006-Sept. 3 2006
Firstpage
4119
Lastpage
4122
Abstract
A model cell membrane can be ingeniously used to mimic biological processes with wide applications in the biomedical field. For instance, a model cell membrane can be used as a functionalized element integrated to a sensor for identification of specific proteins or other molecules in a biofluid. A special characteristic of the model membrane described in this work is the fluidic or surface mobility feature given by a thin film of grafted polymer that serves as a cushion layer to support lipid bilayers. Lipid bilayers were deposited on a polyethylene glycol (PEG) thin film over a polished glass substrate using the Langmuir-Blodgett technique. Topographical characterization of the bilayers was accomplished using atomic force microscopy (AFM). Results revealed that the grafted polymeric PEG cushion layer confers mobility to the model membrane
Keywords
Langmuir-Blodgett films; atomic force microscopy; biochemistry; biological techniques; biosensors; lipid bilayers; molecular biophysics; polymer films; proteins; AFM; Langmuir-Blodgett technique; atomic force microscopy; biofluids; biosensors application; cell membrane model; grafted polymer thin film; polished glass substrate; polyethylene glycol thin film; proteins; soft-supported lipid bilayer membranes; surface mobility feature; topographical characterization; Atomic force microscopy; Biological processes; Biological system modeling; Biomembranes; Biosensors; Cells (biology); Lipidomics; Polymer films; Proteins; Sensor phenomena and characterization;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
Conference_Location
New York, NY
ISSN
1557-170X
Print_ISBN
1-4244-0032-5
Electronic_ISBN
1557-170X
Type
conf
DOI
10.1109/IEMBS.2006.260087
Filename
4462707
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