• DocumentCode
    471945
  • Title

    The Effect of Laser Wavelength in the Simulation of Laser Generated Surface Waves in Human Skin Model

  • Author

    Etang, Adele L. ; Huang, Zhihong

  • Author_Institution
    Div. of Mech. Eng. & Mechatronics, Dundee Univ.
  • fYear
    2006
  • fDate
    Aug. 30 2006-Sept. 3 2006
  • Firstpage
    4140
  • Lastpage
    4143
  • Abstract
    A finite element (FE) simulation of the thermoelastic laser generated surface waves in a 3-layered model of human skin is presented. Commercial finite element code ANSYS is used to study the effects of changing laser wavelength and hence the optical absorption has on the generated surface waves. The FE model consists of a thermal analysis with a volumetric heat generation boundary condition to simulate the thermal effect of the laser source penetrating into the skin. The results from the thermal analysis are then subsequently applied as a load in a mechanical analysis where the out-of plane displacement histories and temperature fields are analysed using two different laser sources to generate the ultrasonic waves
  • Keywords
    bio-optics; bioacoustics; biological effects of laser radiation; biothermics; finite element analysis; light absorption; medical computing; physiological models; skin; surface acoustic waves; thermal analysis; thermoelasticity; ultrasonic waves; 3-layered model; ANSYS code; boundary condition; finite element simulation; human skin model; laser wavelength effects; mechanical analysis; optical absorption; out-of plane displacement histories; temperature fields; thermal analysis; thermoelastic laser generated surface waves; ultrasonic waves; volumetric heat generation; Absorption; Boundary conditions; Finite element methods; Humans; Laser modes; Optical surface waves; Skin; Surface emitting lasers; Surface waves; Thermoelasticity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1557-170X
  • Print_ISBN
    1-4244-0032-5
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2006.259680
  • Filename
    4462712