• DocumentCode
    472004
  • Title

    A High-Resolution Anisotropic Finite-Volume Head Model for EEG Source Analysis

  • Author

    Cook, Michael J.D. ; Koles, Zoltan J.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Alberta Univ., Edmonton, Alta.
  • fYear
    2006
  • fDate
    Aug. 30 2006-Sept. 3 2006
  • Firstpage
    4536
  • Lastpage
    4539
  • Abstract
    Solution of the electroencephalogram (EEG) forward problem in a realistic head model is necessary for accurate source analysis. Realistic head models are usually derived from volumetric magnetic resonance images that provide a voxel resolution of about 1 mm3 . The availability of an electrical head model with this resolution would therefore be extremely advantageous. Head models with resolution in the millimeter range that incorporate the anisotropic properties of their elements have been formulated with the finite element method (FEM). However, these FEM models are fraught with complications related to irregular grids and meshes, along with the incumbent segmentation problems. Presented here is a finite volume method (FVM) formulation of the realistic head model in cubic elements that can ameliorate some of these problems, can incorporate tissue anisotropy, and is both physically intuitive and simple to implement
  • Keywords
    biological tissues; electroencephalography; finite volume methods; physiological models; EEG source analysis; FEM; FVM; anisotropic finite-volume head model; electrical head model; electroencephalogram; finite element method; finite volume method; forward problem; tissue anisotropy; volumetric magnetic resonance image; Anisotropic magnetoresistance; Bioelectric phenomena; Brain modeling; Conductivity; Diffusion tensor imaging; Electric potential; Electroencephalography; Finite element methods; Finite volume methods; Magnetic heads;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2006. EMBS '06. 28th Annual International Conference of the IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1557-170X
  • Print_ISBN
    1-4244-0032-5
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2006.260314
  • Filename
    4462811