DocumentCode :
472660
Title :
Wafer Stress Durinlg Rapid Thermal Annealing Due to Surface Geometrical Patterns
Author :
Ohno, Yasuo ; Kitajo, Sakae ; Moriyama, Ichiro
Author_Institution :
Microelectronics Research Labs., NEC Corporation 1-1, Miyazaki 4-Chome, Miyamae-ku, Kawasaki, Japan
fYear :
1985
fDate :
14-16 May 1985
Firstpage :
86
Lastpage :
87
Keywords :
Cooling; Heat transfer; Heating; Rapid thermal annealing; Rapid thermal processing; Silicon; Temperature distribution; Tensile stress; Thermal conductivity; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1985. Digest of Technical Papers. Symposium on
Conference_Location :
Kobe, Japan
Print_ISBN :
4-930813-09-3
Type :
conf
Filename :
4480316
Link To Document :
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