472660

Wafer Stress Durinlg Rapid Thermal Annealing Due to Surface Geometrical Patterns

Ohno, Yasuo ; Kitajo, Sakae ; Moriyama, Ichiro

Microelectronics Research Labs., NEC Corporation 1-1, Miyazaki 4-Chome, Miyamae-ku, Kawasaki, Japan

1985

14-16 May 1985

86

87

Cooling; Heat transfer; Heating; Rapid thermal annealing; Rapid thermal processing; Silicon; Temperature distribution; Tensile stress; Thermal conductivity; Thermal stresses;

English

ieee

VLSI Technology, 1985. Digest of Technical Papers. Symposium on

Kobe, Japan

4-930813-09-3

conf

4480316