Title :
LPCVD Tungsten Silicide with Titanium Underlayer
Author :
Joshi, Rajiv V. ; Krusin-Elbaum, L. ; Wetzel, J.T. ; Herd, S.R. ; Brodsky, S. ; Karasinski, J.
Author_Institution :
IBM T. J. Watson Research Center Yorktown Heights, New York 10598
Keywords :
Adhesives; Annealing; Conductivity; Mass spectroscopy; Metallization; Silicides; Temperature; Titanium; Tungsten; Very large scale integration;
Conference_Titel :
VLSI Technology, 1986. Digest of Technical Papers. Symposium on
Conference_Location :
San Diego, CA, USA
