DocumentCode :
472705
Title :
A New Multilevel Interconnection System for Submicron VLSI Using Multilayered Dielectrics of Plasma Silicon Oxide and Low Thermal Expansion Polyimide
Author :
Misawa, Y. ; Kinjo, N. ; Hirao, M. ; Numata, S. ; Momma, N.
Author_Institution :
Hitachi Research Laboratory, Hitachi, Ltd. 4026 Kuji-cho, Hitachi-shi, Ibaraki-ken, 319-12, Japan
fYear :
1986
fDate :
28-30 May 1986
Firstpage :
59
Lastpage :
60
Keywords :
Dielectrics; Dry etching; Fabrication; Planarization; Plasma applications; Polyimides; Silicon; Sputter etching; Thermal expansion; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1986. Digest of Technical Papers. Symposium on
Conference_Location :
San Diego, CA, USA
Type :
conf
Filename :
4480369
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=472705
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