Title :
PASPAC (Planaraized Al/Silicide/Poly Si with Self Aligned Contact) with Low Contact Resistance and High Reliability in CMOS LSIs
Author :
Kakumu, Masakazu ; Hashimoto, Kazuhiko ; Matsunaga, Jun´Ichi ; Asami, Tetsuya
Author_Institution :
Semiconductor Device Enginnering Laboratory Toshiba Corporation 1, Komukai Toshiba-cho, Saiwai-ku, Kawasaki 210, Japan
Keywords :
Contact resistance; Degradation; Filling; Lithography; Metallization; Ohmic contacts; Optical films; Optical mixing; Silicides; Sputter etching;
Conference_Titel :
VLSI Technology, 1987. Digest of Technical Papers. Symposium on
Conference_Location :
Karuizawa, Japan
