DocumentCode :
472855
Title :
Wafer Design
Author :
Takasu, Shin.
Author_Institution :
Toshiba Research and Development Center Kawasaki 210 Japan
fYear :
1982
fDate :
1-3 Sept. 1982
Firstpage :
80
Lastpage :
81
Keywords :
Gettering; Heat treatment; History; Large scale integration; Manufacturing processes; Oxygen; Silicon; Surface treatment; Temperature; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1982. Digest of Technical Papers. Symposium on
Conference_Location :
Oiso, Japan
Type :
conf
Filename :
4480586
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=472855
بازگشت