Title :
Phase Change Liner Stressor for Strain Engineering of P-Channel FinFETs
Author :
Yinjie Ding ; Ran Cheng ; Shao-Ming Koh ; Bin Liu ; Yee-Chia Yeo
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
Abstract :
A novel Ge2Sb2Te5 (GST) liner stressor for enhancing the drive current in p-channel FinFETs (p-FinFETs) is demonstrated. When amorphous GST changes phase to crystalline GST (c-GST), the GST material contracts. This phenomenon is exploited for strain engineering of p-FinFETs. A GST liner stressor wrapping a p-FinFET can be shrunk or contracted to generate very high channel stress for drive current enhancement. Saturation drain current enhancement of ~80% and linear drain current enhancement of ~110% are observed for FinFETs with c-GST liner stressor over the control or unstrained FinFETs. The drain current enhancement is higher for 0° rotated FinFETs as compared with that of the FinFETs with 45° rotation, due to the orientation-dependent piezoresistance coefficients. The drain current enhancement increases with decreasing gate length. GST liner stressor could be a strain engineering option in sub-20-nm technology nodes.
Keywords :
MOSFET; germanium compounds; piezoresistance; stress-strain relations; Ge2Sb2Te5; crystalline GST material contract; drive current enhancement; linear drain current enhancement; orientation-dependent piezoresistance coefficient; p-FinFET; p-channel FinFET; phase change liner stressor; saturation drain current enhancement; size 20 nm; strain engineering; very high channel stress; FinFETs; Logic gates; Scanning electron microscopy; Silicon; Silicon compounds; Strain; Stress; ${rm Ge}_{2}{rm Sb}_{2}{rm Te}_{5}$ (GST); FinFET; multigate FET; phase change; strain;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2013.2271643