DocumentCode :
472896
Title :
Microcapiliary Thermal Interface Technology for VLSI Packaging
Author :
Tuckerman, David B. ; Pease, R.Fabian
Author_Institution :
Stanford Electronics Laboratories Stanford University Stanford, CA 94305
fYear :
1983
fDate :
13-15 Sept. 1983
Firstpage :
60
Lastpage :
61
Keywords :
Electronic packaging thermal management; Heat sinks; Microscopy; Shape; Silicon; Surface resistance; Surface tension; Thermal conductivity; Thermal resistance; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1983. Digest of Technical Papers. Symposium on
Conference_Location :
Maui, HI, USA
Print_ISBN :
4-930813-05-0
Type :
conf
Filename :
4480636
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=472896
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