DocumentCode :
472931
Title :
Multilevel Metallization Technology for VLSIs
Author :
Okabayashi, Hidekazu
Author_Institution :
Microelectronics Research Labs. NEC Corp. 4-1-1 Miyazaki, Miyamae-ku, Kawasaki 213, Japan
fYear :
1984
fDate :
10-12 Sept. 1984
Firstpage :
20
Lastpage :
23
Keywords :
Capacitance; Conductivity; Integrated circuit interconnections; Metallization; Planarization; Plasma temperature; Polyimides; Sputter etching; Sputtering; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1984. Digest of Technical Papers. Symposium on
Conference_Location :
San Diego, CA, USA
Print_ISBN :
4-930813-08-5
Type :
conf
Filename :
4480680
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=472931
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