DocumentCode :
473326
Title :
Fully embedded CDMA cellular-band lumped LC-quadrature hybrid coupler into organic package substrate
Author :
Lee, Yi Jae ; Park, Jae Yeong
Author_Institution :
Dept. of Electron. Eng., Kwangwoon Univ., Seoul
fYear :
2007
fDate :
29-31 Dec. 2007
Firstpage :
81
Lastpage :
84
Abstract :
In this paper, fully embedded lumped LC-quadrature hybrid coupler are designed, fabricated, and characterized into multi-layered organic packaging substrate. This embedded device is comprised of high Q MIM capacitors and circular spiral stacked inductors. For realizing fully embedded high Q capacitor, barium titanate (BaTiO3) composite high Dk film was utilized. The measured return loss and isolation are better than 25 dB. Measured insertion loss is about 0.38 ~ 0.42 dB at the frequencies ranged from 824 MHz to 894 MHz (CDMA cellular-band). The coupler exhibits a coupling loss of 23.3 ~ 24 dB. The phase difference between through and coupling ports is 1.2 ~ 2.4 degree. It has a size of 2.8 mm times 2.95 mm times 0.66 mm (height), which is the smallest one in the couplers developed onto the package substrate. The measured performance characteristics are well matched with the 3D EM simulated ones.
Keywords :
MIM devices; UHF integrated circuits; barium compounds; capacitors; cellular radio; code division multiple access; electronics packaging; inductors; waveguide couplers; BaTiO3; CDMA cellular-band; cellular-band lumped LC-quadrature hybrid coupler; circular spiral stacked inductor; frequency 824 MHz to 894 MHz; fully embedded CDMA hybrid coupler; high Dk film; high Q MIM capacitor; organic package substrate; phase difference; size 0.66 mm; size 2.8 mm; size 2.95 mm; Barium; Frequency measurement; Insertion loss; Loss measurement; MIM capacitors; Multiaccess communication; Packaging; Spirals; Substrates; Titanium compounds; Barium titanate(BaTiO3) composite film; Embedded quadrature hybrid coupler; High Q MIM capacitor; High Q spiral stacked inductor; Organic packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronics, 2007. ICM 2007. Internatonal Conference on
Conference_Location :
Cairo
Print_ISBN :
978-1-4244-1846-6
Electronic_ISBN :
978-1-4244-1847-3
Type :
conf
DOI :
10.1109/ICM.2007.4497666
Filename :
4497666
Link To Document :
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