Title :
The effect of bonding conditions on the electrical properties of solder joints fabricated by mechanical caulking using reflowed Sn bumps
Author :
Yang, Ju-heon ; Kim, Young-Ho ; Moon, Jae-Seung ; Lee, Won-Jong
Author_Institution :
Department of Materials Science & Engineering, Hanyang Univ., Korea
Keywords :
Bonding; Mechanical factors; Soldering; Tin;
Conference_Titel :
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location :
Daejeon, Korea
Print_ISBN :
978-1-4244-1909-8
Electronic_ISBN :
978-1-4244-1910-4
DOI :
10.1109/EMAP.2007.4510303
