DocumentCode :
473622
Title :
Transient current modeling & power delivery analysis for next gen chipset core
Author :
Tan, Fern Nee ; Chai, Aissa ; Pang, Sze Geat ; Sasidaran, Dhinesh ; Ng, Kiat Hong ; Deo, Song Chin ; Lee, Chee Siong ; Lim, Jin Sean ; Ooi, Poey Ling ; Loke, Chee Ngai ; Lim, Meng Chong
fYear :
2007
fDate :
19-22 Nov. 2007
Firstpage :
1
Lastpage :
23
Keywords :
Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2007. EMAP 2007. International Conference on
Conference_Location :
Daejeon, Korea
Print_ISBN :
978-1-4244-1909-8
Electronic_ISBN :
978-1-4244-1910-4
Type :
conf
DOI :
10.1109/EMAP.2007.4510311
Filename :
4510311
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=473622
