• DocumentCode
    474181
  • Title

    Development of planar components using advanced fabrication

  • Author

    Ito, N. ; Mase, A. ; Kogi, Y. ; Seko, N. ; Tamada, M. ; Sakata, E.

  • Author_Institution
    Sci. & Technol. Center for Cooperative Res., Kyushu Univ., Fukuoka
  • fYear
    2007
  • fDate
    2-9 Sept. 2007
  • Firstpage
    791
  • Lastpage
    792
  • Abstract
    As the importance of intelligent transport system (ITS) and imaging diagnostics increases, the fabrication of high performance millimeter-wave planar components becomes essential. This paper describes the development of high performance millimeter-wave planar components such as antennas using a low-loss fluorine substrate. The problems to be solved are the low degree of adhesion between copper foil and the fluorine substrate and the shape of the antenna pattern. In order to solve the problems, surface treatment of fluorine films and a fabrication method using electro fine forming (EF2) are utilized.
  • Keywords
    adhesion; antenna radiation patterns; electroforming; submillimetre wave antennas; surface treatment; adhesion; antenna pattern; electrofine forming; fabrication method; fluorine film surface treatment; imaging diagnostics; intelligent transport system; low-loss fluorine substrate; millimeter-wave planar components; planar components; Adhesives; Copper; Dielectric constant; Fabrication; Intelligent systems; Millimeter wave technology; Polymer films; Resins; Substrates; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Infrared and Millimeter Waves, 2007 and the 2007 15th International Conference on Terahertz Electronics. IRMMW-THz. Joint 32nd International Conference on
  • Conference_Location
    Cardiff
  • Print_ISBN
    978-1-4244-1438-3
  • Type

    conf

  • DOI
    10.1109/ICIMW.2007.4516733
  • Filename
    4516733