Advanced Laser Microprocessing for Substrates Microprocessing of Microsystems and Optoelectronics Devices Applications

Author

Ulieru, D. ; Tantau, Adrian ; Ulieru, E. ; Cernica, Ileana ; Matei, Alina ; Schiopu, Vasilica ; Pistritu, Florian

Author_Institution

ROMES SA, Hong Kong

Volume

1

fYear

2007

fDate

Oct. 15 2007-Sept. 17 2007

Firstpage

155

Lastpage

158

Abstract

Lasers are an important tool in the fabrication of microsystems like MOEMS and photonic components and in particular their use in scribing for separating LED dies on sapphire substrates. This paper describes scribing and cutting of sapphire and GaN using UV lasers (355 nm and 266 nm harmonics of Nd:YVO₄ and 255 nm harmonic of CVL). Scribing of sapphire at speeds of 30 mm/s have been achieved and cutting of sapphire of up to 700 microns thickness has been demonstrated.

Keywords

light emitting diodes; optoelectronic devices; LED dies; MOEMS; advanced laser microprocessing; optoelectronics devices; photonic components; sapphire substrates; substrates microprocessing; Gallium nitride; Gas lasers; Laser ablation; Laser transitions; Light emitting diodes; Optical pulses; Optoelectronic devices; Power lasers; Solid lasers; Testing; LED; Laser scribing; UV lasers; gallium nitride; micromachining; sapphire;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference, 2007. CAS 2007. International

Conference_Location

Sinaia

ISSN

1545-827X

Print_ISBN

978-1-4244-0847-4

Type

conf

DOI

10.1109/SMICND.2007.4519670

Filename

4519670