Title :
Characterizing chip-multiprocessor variability-tolerance
Author :
Herbert, Sebastian ; Marculescu, Diana
Author_Institution :
Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA
Abstract :
Spatially-correlated intra-die process variations result in significant core-to-core frequency variations in chip-multiprocessors. An analytical model for frequency island chip-multiprocessor throughput is introduced. The improved variability-tolerance of FI-CMPs over their globally-clocked counterparts is quantified across a range of core counts and sizes under constant die area. The benefits are highest for designs consisting of many small cores, with the throughput of a globally-clocked design with 70 small cores increasing by 8.8% when per-core frequency islands are used. The small- core FI-CMP also loses only 7.2% of its nominal performance to process variations, the least among any of the designs.
Keywords :
fault tolerance; logic design; microprocessor chips; multiprocessing systems; chip-multiprocessor variability-tolerance; constant die area; core-to-core frequency variations; frequency island CMP; globally-clocked design; small- core FI-CMP; spatially-correlated intra-die process variations; Analytical models; Delay; Displays; Frequency control; Monte Carlo methods; Performance analysis; Permission; Process design; Throughput; Yarn; Process variability; chip-multiprocessor; frequency islands;
Conference_Titel :
Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-60558-115-6