DocumentCode :
474544
Title :
An integrated nonlinear placement framework with congestion and porosity aware buffer planning
Author :
Chen, Tung-Chieh ; Chakraborty, Ashutosh ; Pan, David Z.
Author_Institution :
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei
fYear :
2008
fDate :
8-13 June 2008
Firstpage :
702
Lastpage :
707
Abstract :
Due to skewed scaling of interconnect versus cell delay in deep submicron CMOS, modern VLSI timing closure requires extensive buffer insertion. Inserting a large number of buffers may cause not only dramatic cell migration but also routing hotspots. If buffering is not controlled well, it may fail to close a design. Placement with buffer porosity (i.e., cell density) awareness can allocate space for inserting these buffers, and buffering with congestion awareness can improve the routability. Therefore, there is essential need for a placement framework with explicit porosity and congestion control. In this paper, we propose the first integrated nonlinear placement framework with porosity and congestion aware buffer planning. We demonstrate the integration of increasingly refined cell porosity and routing congestion aware buffer planning and insertion methodology in a high quality nonlinear placer. Our experiments show the improvement of average routing overflow by 69%, average wirelength by 28% and average buffer count by 40%, compared with the traditional placement framework without buffer planning.
Keywords :
CMOS integrated circuits; VLSI; buffer circuits; circuit optimisation; integrated circuit design; integrated circuit interconnections; network routing; porosity; average buffer count; average routing overflow; average wirelength; cell delay; cell porosity; congestion aware buffer planning; deep submicron CMOS; extensive buffer insertion length; high quality nonlinear placer; integrated nonlinear placement framework; interconnect optimization; interconnects skewed scaling; modern VLSI timing closure; porosity aware buffer planning; routing congestion; Algorithm design and analysis; Delay; Explosions; Integrated circuit interconnections; Integrated circuit technology; Routing; Space technology; Timing; Very large scale integration; Wire; Buffer; Physical Design; Placement; VLSI;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE
Conference_Location :
Anaheim, CA
ISSN :
0738-100X
Print_ISBN :
978-1-60558-115-6
Type :
conf
Filename :
4555910
Link To Document :
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