• DocumentCode
    474565
  • Title

    A power and temperature aware DRAM architecture

  • Author

    Liu, Song ; Memik, Seda O. ; Zhang, Yu ; Memik, Seda Ogrenci

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL
  • fYear
    2008
  • fDate
    8-13 June 2008
  • Firstpage
    878
  • Lastpage
    883
  • Abstract
    Technological advances enable modern processors to utilize increasingly larger DRAMs with rising access frequencies. This is leading to high power consumption and operating temperature in DRAM chips. As a result, temperature management has become a real and pressing issue in high performance DRAM systems. Traditional low power techniques are not suitable for high performance DRAM systems with high bandwidth. In this paper, we propose and evaluate a customized DRAM low power technique based on page hit aware write buffer (PHA-WB). Our proposed approach reduces DRAM system power consumption and temperature without any performance penalty. Our experiments show that a system with a 64-entry PHA-WB could reduce the total DRAM power consumption by up to 22.0% (9.6% on average). The peak and average temperature reductions are 6.1degC and 2.1degC, respectively.
  • Keywords
    DRAM chips; buffer storage; low-power electronics; memory architecture; thermal management (packaging); DRAM architecture; DRAM chips; DRAM power consumption; low power technique; page hit aware write buffer; temperature management; Bandwidth; Computer architecture; Energy consumption; Energy management; Memory management; Permission; Power system management; Random access memory; System performance; Temperature; DRAM; Page Hit Aware Write Buffer; Power; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2008. DAC 2008. 45th ACM/IEEE
  • Conference_Location
    Anaheim, CA
  • ISSN
    0738-100X
  • Print_ISBN
    978-1-60558-115-6
  • Type

    conf

  • Filename
    4555943