• DocumentCode
    475468
  • Title

    Single event upset modeling with nuclear reactions in nanoscale electronics

  • Author

    Turowski, M. ; Fedoseyev, A. ; Raman, A. ; Warren, K.

  • Author_Institution
    CFD Research Corporation (CFDRC), USA
  • fYear
    2008
  • fDate
    19-21 June 2008
  • Firstpage
    443
  • Lastpage
    448
  • Abstract
    In modern nano-scale technologies, circuits are increasingly sensitive to various kinds of perturbations. Soft errors, a concern for space applications in the past, are now a top reliability issue at ground level. Alpha particles and atmospheric neutrons induce single-event upsets (SEU), affecting memory cells, latches, and flip-flops, and single-event transients (SET), initiated in the combinational logic and captured by the latches and flip-flops associated with the outputs of this logic. Realistic treatment of the materials and geometries in the back-end-of-line (BEOL), including metallization layers, is essential for accurate modeling of particle-induced single event effects (SEEs). This paper describes new capabilities of CFDRC NanoTCAD mixed-mode simulator, which include interface and adaptive meshing to allow simulations of single event radiation effects with nuclear reactions and secondary particles computed by MRED (Monte Carlo Radiative Energy Deposition), a Geant4 based tool developed at Vanderbilt University. Neglecting the nuclear interaction processes may results in serious underestimation of the SEU error rate for modern technologies.
  • Keywords
    Atmospheric modeling; Circuits; Computational modeling; Discrete event simulation; Flip-flops; Latches; Logic; Nuclear electronics; Single event upset; Space technology; Alpha particles; Ionizing radiation effects; Reliability; SET; SEU; Single event effects; Soft errors;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Mixed Design of Integrated Circuits and Systems, 2008. MIXDES 2008. 15th International Conference on
  • Conference_Location
    Poznan, Poland
  • Print_ISBN
    978-83-922632-7-2
  • Electronic_ISBN
    978-83-922632-8-9
  • Type

    conf

  • Filename
    4600955