DocumentCode
475469
Title
Trade-off between on-chip decoupling capacitor and error tolerance in digital IC’S under noisy environment
Author
Andrade, D. ; Martorell, F. ; Moll, F. ; Rubio, A.
Author_Institution
Technical University of Catalonia, SPAIN
fYear
2008
fDate
19-21 June 2008
Firstpage
449
Lastpage
454
Abstract
Modern VLSI systems are continuously increasing its operating frequency, device density and parallelism which increase the magnitude and slew rate of transient demanded current. These trends in combination with the parasitic inductance of IC package and resistive nature of Power Delivery Network (PDN) results on power-to-ground voltage fluctuations causing timing violations on digital circuits. As technology advances the operating voltage levels are reduced aggravating these problems as noise does not scale with technology. The most commonly used solution is to incorporate on-chip decoupling capacitors to the PDN to keep the noise within a tolerance margin ensuring circuits functionality. However, the cost of this technique in area and leakage current increases with technology node. In this paper the trade-off between reducing on-chip decoupling capacitors size, its consequence on voltage level fluctuations and error rate due to timing violations is analyzed for incoming technologies.
Keywords
Capacitors; Digital integrated circuits; Frequency; Inductance; Integrated circuit noise; Integrated circuit packaging; Timing; Very large scale integration; Voltage fluctuations; Working environment noise; Decoupling Capacitor; Fault tolerant VLSI design; di/dt noise;
fLanguage
English
Publisher
iet
Conference_Titel
Mixed Design of Integrated Circuits and Systems, 2008. MIXDES 2008. 15th International Conference on
Conference_Location
Poznan, Poland
Print_ISBN
978-83-922632-7-2
Electronic_ISBN
978-83-922632-8-9
Type
conf
Filename
4600956
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