• DocumentCode
    475526
  • Title

    Study on MCM interconnect test generation using ant algorithm and particle swarm optimization algorithm

  • Author

    Lei, Chen

  • Author_Institution
    Guilin Univ. of Electron. Technol., Guilin
  • fYear
    2008
  • fDate
    28-31 July 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A new approach based on ant algorithm (AA) and particle swarm optimization (PSO) algorithm is proposed for Multi-chip Module (MCM) interconnect test generation in this paper. Using the pheromone-updating rule and state transition rule, AA generates the initial candidate test vectors. PSO is employed to evolve the candidates generated by AA. The optimized search is guided by the swarm intelligent generated from cooperation and competition among particles of swarm, in order to get the best test vector with the high fault coverage. The international standard MCM benchmark circuit provided by the MCNC group was used to verify the approach. Comparing with the evolutionary algorithms and the deterministic algorithms, experimental results demonstrate that the approach can achieve high fault coverage and short execution time.
  • Keywords
    integrated circuit interconnections; integrated circuit testing; multichip modules; particle swarm optimisation; MCM benchmark circuit; MCM interconnect test generation; ant algorithm; digital integrated circuit; multichip module interconnect test generation; particle swarm optimization algorithm; pheromone-updating rule; state transition rule; Circuit faults; Circuit testing; Convergence; Evolutionary computation; Integrated circuit interconnections; Integrated circuit technology; Logic; Multichip modules; Particle swarm optimization; Very large scale integration; Ant algorithm; MCM (Multi-chip Module); Particle swarm optimization; interconnect test; test generation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-2739-0
  • Electronic_ISBN
    978-1-4244-2740-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2008.4607155
  • Filename
    4607155